Recommended Citation
M. O'Keefe et al., "Vibration Testing of Repaired Lead-tin/Lead-Free Solder Joints," Proceedings of the 56th Electronic Components and Technology Conference, 2006, Institute of Electrical and Electronics Engineers (IEEE), Jan 2006.
The definitive version is available at https://doi.org/10.1109/ECTC.2006.1645853
Meeting Name
56th Electronic Components and Technology Conference, 2006
Department(s)
Materials Science and Engineering
International Standard Serial Number (ISSN)
0569-5503
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 2006
