The Role of Electrolyte Additives on Passivation Behaviour During Copper Electrorefining

Author

Michael S. Moats, Missouri University of Science and TechnologyFollow
J. Brent Hiskey

Editor(s)

McDermid, J. R.

Abstract

Additives, such as chloride, thiourea and glue, are commonly added to electrorefining electrolyte to control deposition structure and morphology. Very few studies have been performed to observe their effects on anode passivation. Chronopotentiometry was utilized to observe the passivation behaviour of commercial copper anodes in synthetic electrolyte. The effect of chloride, thiourea and glue were investigated individually. A simulated electrolyte containing all three additives was used in conjunction with twenty commercial copper anode samples to determine possible interactions between additives and anode composition.

Recommended Citation

M. S. Moats and J. B. Hiskey, "The Role of Electrolyte Additives on Passivation Behaviour During Copper Electrorefining," Canadian Metallurgical Quarterly, Maney Publishing, Jan 2000.

The definitive version is available at https://doi.org/10.1179/000844300794256855

Department(s)

Materials Science and Engineering

International Standard Serial Number (ISSN)

0008-4433

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2000 Maney Publishing, All rights reserved.

Publication Date

01 Jan 2000