Detecting Brittle Fracture Failures
The article focuses on the implication of the back-end process in comparing brittle fracture in semiconductor elements in the U.S. A correlation analysis illustrates the failure and brittle failure percentage of ball shear. According to a micro-structural observations, high-speed bond testing and conventional drop testing are the two important methodologies in evaluating brittle failure in shear.
S. L. Clark, "Detecting Brittle Fracture Failures," Advanced Packaging, Penwell, Jan 2007.
Mathematics and Statistics
Keywords and Phrases
semiconductor industry; fracture mechanics; shear (mechanics); microelectrics
Article - Journal
© 2007 Penwell, All rights reserved.
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