Title

Detecting Brittle Fracture Failures

Abstract

The article focuses on the implication of the back-end process in comparing brittle fracture in semiconductor elements in the U.S. A correlation analysis illustrates the failure and brittle failure percentage of ball shear. According to a micro-structural observations, high-speed bond testing and conventional drop testing are the two important methodologies in evaluating brittle failure in shear.

Department(s)

Mathematics and Statistics

Keywords and Phrases

semiconductor industry; fracture mechanics; shear (mechanics); microelectrics

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2007 Penwell, All rights reserved.

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