Keywords and Phrases
"This thesis investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated under water. Interestingly, a particular parameter combination enables a smooth surface, which can improve the surface quality of micro-machining products. This thesis first investigates the single ablation and multi-pulse ablation processes in order to study the effects of laser parameters on ablation morphology, as well as the basic physics and mechanism of the laser-material interaction process under water...Next femtosecond laser direct writing process in water confinement is investigated...The unique discovery of a smoothly processed silicon surface in water confinement under certain laser parameter combinations may help improve laser direct micro-machining surface quality in industrial application"--Abstract, page iii.
Xiao, Hai, Dr.
Alofs, Darryl J.
Mechanical and Aerospace Engineering
M.S. in Mechanical Engineering
Missouri University of Science and Technology
ix, 75 pages
© 2008 Songping Wu, All rights reserved.
Thesis - Open Access
Library of Congress Subject Headings
Laser pulses, Ultrashort
Lasers -- Industrial applications
Print OCLC #
Electronic OCLC #
Link to Catalog Recordhttp://laurel.lso.missouri.edu/record=b6489947~S5
Wu, Songping, "Femtosecond laser micro-structuring of silicon wafer in water confinement" (2008). Masters Theses. 6853.