Keywords and Phrases
Reactive ion etching
"In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was optimized to achieve vertical sidewalls. Sidewall verticality of dry film is very important for better pattern transfer"--Abstract, page iv.
Miller, F. Scott, 1956-
Materials Science and Engineering
M.S. in Materials Science and Engineering
National Science Foundation (U.S.)
University of Missouri--Rolla
Journal article titles appearing in thesis/dissertation
- Process development and application of dry film photoresist in MEMS
- Process development for reactive-ion etching of dry film photoresist
x, 66 pages
© 2007 Phaninder Reddy Kanikella, All rights reserved.
Thesis - Open Access
Library of Congress Subject Headings
Semiconductors -- Etching
Print OCLC #
Electronic OCLC #
Link to Catalog Recordhttp://laurel.lso.missouri.edu/record=b6400406~S5
Kanikella, Phaninder R., "Process development and applications of a dry film photoresist" (2007). Masters Theses. 6821.