Design of a current probe for measuring ball grid array packaged devices
"A current probe to measure BGA ball currents via magnetic induction has been designed. The probe is manufactured on a 4 layer flex circuit and has been validated by full wave simulations and measurements. The feature size of the probe is very tiny that it almost pushes the limit of flex-circuit technology. Several critical manufacturing problems were happened, and they have been solved now. The probe allows measuring currents of a 1 mm pitch BGA ball directly. Its operating frequency stretched from tens of MHz up to 3GHz. The BGA probe's mutual inductance is approximately 11 pH, and with amplifiers the signal is large enough to be visible in real time on an oscilloscope. Moreover, a frequency-domain-calibration program has been developed to correct the measured data. And a FPGA DUT board is designed and manufactured, to demonstrate the application of the BGA probe. ADS model is also developed to show the principle of how the probe works"--Abstract, page iii.
Beetner, Daryl G.
Fan, Jun, 1971-
Electrical and Computer Engineering
M.S. in Electrical Engineering
Missouri University of Science and Technology
ix, 55 pages
© 2011 Tianqi Li, All rights reserved.
Thesis - Open Access
Library of Congress Subject Headings
Ball grid array technology
Print OCLC #
Electronic OCLC #
Link to Catalog Recordhttp://laurel.lso.missouri.edu/record=b8627155~S5
Li, Tianqi, "Design of a current probe for measuring ball-grid-array packaged devices" (2011). Masters Theses. 5213.