Effects of lead contamination on lead-free solders
Keywords and Phrases
Solder shear strength
"With growing concerns over environmental issues and recent legislation, the use of tin-lead solders is being rapidly replaced by lead-free (LF) solders. The rapid replacement of the tin-lead solders with lead-free solders has raised issues, particularly in the aerospace and defense industries, over the maintainability and repairability of electronic assemblies. Due to the long life cycle of these aerospace vehicles, repair and maintenance of electronic assemblies are critical in ensuring proper operation. An area that has lacked significant attention is repair, particularly hand repair using LF solders. This can result in a mixture of tin-lead (SnPb) and LF solders of various composition. In this study, SnPb, LF, and mixed solder joints were analyzed following thermally cycling and aging at 150⁰C to examine the composition and environmental effects on solder joints"--Abstract, leaf iv.
Miller, F. Scott, 1956-
Materials Science and Engineering
M.S. in Metallurgical Engineering
U.S. Air Force Research Laboratory (Wright-Patterson Air Force Base, Ohio)
University of Missouri--Rolla
Journal article titles appearing in thesis/dissertation
- Perspectives on repaired lead-free solder joints
- Aging effects on mixed tin-lead and lead free (Sn/Ag/Cu) solder joints
x, 39 leaves
© 2006 Richard Shigemichi Colfax, All rights reserved.
Thesis - Citation
Library of Congress Subject Headings
Lead-free electronics manufacturing processes
Solder and soldering -- Testing
Print OCLC #
Link to Catalog Record
Full-text not available: Request this publication directly from Missouri S&T Library or contact your local library.http://laurel.lso.missouri.edu/record=b5769805~S5
Colfax, Richard S., "Effects of lead contamination on lead-free solders" (2006). Masters Theses. 3849.
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