Mechanical integrity of thin films
Keywords and Phrases
Delamination; Strain energy release rate
"The mechanical integrity of thin films is characterized by the adhesion between solid bodies and membranes. Two methods to evaluate the strain energy release rates of thin film delamination are discussed. This strain energy release rate is useful to the experimentalists in their measurements of adhesion or delamination energy of thin films having wide ranging thickness and stiffness. This thesis is primarily concerned with the pressurized blister test and a novel circular punch loaded technique"--Abstract, leaf iii.
Mechanical and Aerospace Engineering
M.S. in Mechanical Engineering
University of Missouri--Rolla
ix, 63 leaves
© 2004 Anup Arjun, All rights reserved.
Thesis - Citation
Library of Congress Subject Headings
Thin films -- Analysis
Print OCLC #
Link to Catalog Record
Full-text not available: Request this publication directly from Missouri S&T Library or contact your local library.http://laurel.lso.missouri.edu/record=b5395225~S5
Arjun, Anup, "Mechanical integrity of thin films" (2004). Masters Theses. 3638.