Masters Theses

Title

Mechanical integrity of thin films

Author

Anup Arjun

Keywords and Phrases

Delamination; Strain energy release rate

Abstract

"The mechanical integrity of thin films is characterized by the adhesion between solid bodies and membranes. Two methods to evaluate the strain energy release rates of thin film delamination are discussed. This strain energy release rate is useful to the experimentalists in their measurements of adhesion or delamination energy of thin films having wide ranging thickness and stiffness. This thesis is primarily concerned with the pressurized blister test and a novel circular punch loaded technique"--Abstract, leaf iii.

Department(s)

Mechanical and Aerospace Engineering

Degree Name

M.S. in Mechanical Engineering

Publisher

University of Missouri--Rolla

Publication Date

Fall 2004

Pagination

ix, 63 leaves

Note about bibliography

Includes bibliographical references.

Rights

© 2004 Anup Arjun, All rights reserved.

Document Type

Thesis - Citation

File Type

text

Language

English

Library of Congress Subject Headings

Thin films -- Analysis
Adhesion

Thesis Number

T 8662

Print OCLC #

62267703

Link to Catalog Record

Full-text not available: Request this publication directly from Missouri S&T Library or contact your local library.

http://laurel.lso.missouri.edu/record=b5395225~S5

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