"Current methods for the manufacturing of multilayer ceramic capacitors (MLCCs) typically involve tape casting technologies. As the requirement for dielectric layer thickness in multilayer capacitors becomes more stringent, the ability to fabricate devices with micron sized layers becomes correspondingly more difficult via tape casting. A strong interest remains in the industry for the development of a novel, flexible technique for the fabrication of dielectric layers below 5 pm. The result would be MLCCs having greater capacitance and volumetric efficiency in a smaller package, combined with the ability to be mass-produced in any dielectric/electrode composition. Manufacturing of miniaturized MLCCs through a more reliable process would have a significant impact.
To address these issues, the overall objective of the program has been to develop multilayer ceramic capacitors (MLCCs) using Microfabrication by Coextrusion Melt Spinning (MCMS) for controlling the thickness and location of the dielectric and metal electrode layers. MCMS utilizes high shear blending of ceramic powders, as the dielectric layers, and metal powders as the electrode, with a thermoplastic polymer. The program has focused on the processing of doped barium titanate for the dielectric material along with nickel for the metal electrode, with the ultimate goal of fabricating multilayer capacitors of various capacitance values"--Abstract, page iv.
Stoffer, James O.
Materials Science and Engineering
M.S. in Ceramic Engineering
University of Missouri--Rolla
xii, 84 pages
© 2001 Dustin Reid Beeaff, All rights reserved.
Thesis - Restricted Access
Print OCLC #
Electronic OCLC #
Link to Catalog Record
Electronic access to the full-text of this document is restricted to Missouri S&T users. Otherwise, request this publication directly from Missouri S&T Library or contact your local library.http://laurel.lso.missouri.edu/record=b4646682~S5
Beeaff, Dustin Reid, "Fabrication of multilayer ceramic capacitors via thermoplastic coextrusion" (2001). Masters Theses. 2022.
Share My Thesis If you are the author of this work and would like to grant permission to make it openly accessible to all, please click the button above.