Modeling Power Bus Decoupling on Multilayer Printed Circuit Boards

James L. Drewniak, Missouri University of Science and Technology
Todd H. Hubing, Missouri University of Science and Technology
P. Baudendistal
Thomas Van Doren, Missouri University of Science and Technology

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1739

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Abstract

Power bus decoupling designs on multilayer printed circuit boards must adequately account for the power bus interplane capacitance and its consequences for the design. Lumped element models for a power bus on a multilayer printed circuit board where an appreciable or entire portion of a layer is devoted to power and ground have been developed. The models are applicable below the distributed resonances of the board. Analytical, circuit simulation, and experimental studies have been conducted to test the models, investigate the effects of the distributed interplane capacitance of the power bus, and the effect of interconnect inductance associated with surface-mount decoupling capacitors.