Characterizing the Electric Field Coupling from IC Heatsink Structures to External Cables Using TEM Cell Measurements
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One method for evaluating the unintentional radiated emissions from integrated circuits (ICs) involves mounting the IC on a printed circuit board (PCB) embedded in the wall of a transverse electromagnetic (TEM) cell. The signal voltages on the IC and its package produce electric fields that can couple to cables and other structures attached to the PCB, inducing common-mode currents that can be a primary source of unintentional radiated emissions. The signal currents in the IC and its package produce magnetic fields that can also result in common-mode currents on larger radiating structures. This paper describes a TEM cell measurement method employing a hybrid to separate the electric field coupling and the magnetic field coupling. The results of this measurement can be used to determine the product of the IC's self-capacitance and the effective voltage that drives this capacitance. This voltage-capacitance product characterizes the IC's ability to drive common-mode currents onto cables or enclosures due to electric field coupling. This information can then be used to estimate the resulting radiated emissions.