EMI Associated with Inter-Board Connection for Module-on-Backplane and Stacked-card Configurations

Xiaoning Ye
J. Nadolny
James L. Drewniak, Missouri University of Science and Technology
Todd H. Hubing, Missouri University of Science and Technology
Richard E. DuBroff, Missouri University of Science and Technology
Thomas Van Doren, Missouri University of Science and Technology

This document has been relocated to http://scholarsmine.mst.edu/ele_comeng_facwork/1585

There were 6 downloads as of 28 Jun 2016.

Abstract

EMI associated with inter-board connection was studied through common-mode current measurements and FDTD modeling for stacked-card and module-on-backplane configurations. Three types of connections were investigated experimentally including an open pin field connection, an ideal semi-rigid coaxial cable connection, and a production connector. Both microstrip and stripline signal routing on the PCB were investigated. The results indicated signal routing on the PCBs or the inter-board connection can dominate the EMI process. Several cases of connector geometries were studied using FDTD modeling and good agreement was achieved between the measured and FDTD results.