Abstract
Evaluation of thickness and material properties of coatings and dielectric slabs is an important practical issue. Microwave nondestructive testing techniques, using open-ended rectangular waveguide and coaxial probes have shown great potential for this purpose. However, to evaluate one parameter requires that the other be known a priori. This paper discusses the use of a relatively efficient method for evaluating both parameters simultaneously from measurements of the reflection coefficient of a test material. Results of two cases as well as a brief discussion of the limitations of the technique are provided in this paper.
Recommended Citation
J. Lai et al., "Determination of the Thickness and Dielectric Constant of a Dielectric Slab Backed by Free-Space or a Conductor through Inversion of the Reflection Coefficient of a Rectangular Waveguide Probe," Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (2004, Como, Italy), vol. 1, pp. 56 - 60, Institute of Electrical and Electronics Engineers (IEEE), May 2004.
The definitive version is available at https://doi.org/10.1109/IMTC.2004.1350994
Meeting Name
21st IEEE Instrumentation and Measurement Technology Conference (2004, May 18-20, Como, Italy)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Coatings; Coaxial Cables; Coaxial Probes; Composites; Conductor; Dielectric Constant; Dielectric Materials; Dielectric Properties; Dielectric Slab Thickness; Electromagnetic Wave Reflection; Free-Space; Material Properties; Microwave Measurement; Microwave Nondestructive Testing; Microwaves; Nondestructive Testing; Open-Ended Rectangular Waveguide; Probes; Rectangular Waveguide Probe; Rectangular Waveguides; Reflection Coefficient Inversion; Thickness Measurement
International Standard Book Number (ISBN)
078038248X
International Standard Serial Number (ISSN)
1091-5281
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2004
