A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.
M. Cocchini et al., "Differential Vias Transition Modeling in a Multilayer Printed Circuit Board," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, 2008, Institute of Electrical and Electronics Engineers (IEEE), Aug 2008.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2008.4652164
IEEE International Symposium on Electromagnetic Compatibility, 2008
Electrical and Computer Engineering
Materials Science and Engineering
Keywords and Phrases
Cavity Model; Differential Signal; Ground Vias; Noise Coupling; Signal Via Transition; Via Capacitance
Article - Conference proceedings
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