Abstract

A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model has been generated as well. The paper will show that the process of modeling can require a series of adjustments to get reasonable results. A brief discussion about possible issues associated with fabrication tolerances is presented in the last chapter.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility, 2008

Department(s)

Electrical and Computer Engineering

Second Department

Materials Science and Engineering

Keywords and Phrases

Cavity Model; Differential Signal; Ground Vias; Noise Coupling; Signal Via Transition; Via Capacitance

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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