Abstract

This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.

Meeting Name

20th International Zurich Symposium on Electromagnetic Compatibility, 2009. EMC Zurich 2009

Department(s)

Electrical and Computer Engineering

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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