Revised L-2L Method for On-Chip De-Embedding
Abstract
An evaluation is presented on the L–2L de-embedding method for on-chip transmission lines. The method is analyzed using measurement data from two chips. Results are presented in terms of scattering parameters, as is the standard for characterizing system interconnects. The various challenges associated with on-chip modeling and measurements are discussed. Furthermore, a revised version of the L–2L method is presented, decreasing its sensitivity to measurement noise. All de-embedding results are compared back to "ideal" simulation models for validation or disproof.
Recommended Citation
N. Erickson et al., "Revised L-2L Method for On-Chip De-Embedding," IEEE Transactions on Electromagnetic Compatibility, vol. 61, no. 1, pp. 209 - 216, Institute of Electrical and Electronics Engineers (IEEE), Feb 2019.
The definitive version is available at https://doi.org/10.1109/TEMC.2018.2792908
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Sponsor(s)
Cisco Research Grant
National Science Foundation (U.S.)
IEEE Power Electronics Society
Keywords and Phrases
Calibration; De-embedding; Integrated circuit modeling; Integrated circuits (ICs); Interconnects; Lumped element; Mathematical model; Semiconductor device measurement; System-on-chip; Transmission line measurements; Transmission lines
International Standard Serial Number (ISSN)
0018-9375; 1558-187X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Feb 2019
Comments
This work was supported in part by the Cisco Research Grant 575262 and in part by theNational Science Foundation under Grant 0855878.