Estimating the Via-Plane Capacitance for Differential VIAS with Shared-Antipad Based on Analytical Equations
Shared-antipad via structure is commonly used for high-speed printed circuit board (PCB) design. Therefore, an accurate via-plane capacitance evaluation for this kind of geometry is critical to facilitate engineering design. In this paper, the analytical equation of via-plane capacitance for separated-antipad via structure is extended to the shared-antipad via structure case, by using the equivalent area of antipad and ratio revision method. The proposed method is validated with numerical methods in HFSS for a typical structure widely used in practical high-speed PCB design.
Y. Zhang et al., "Estimating the Via-Plane Capacitance for Differential VIAS with Shared-Antipad Based on Analytical Equations," Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (2017, Washington, DC), pp. 272-276, Institute of Electrical and Electronics Engineers (IEEE), Aug 2017.
The definitive version is available at https://doi.org/10.1109/ISEMC.2017.8077879
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (2017: Aug. 7-11, Washington, DC)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Cisco Systems, Inc.
National Science Foundation (U.S.)
Keywords and Phrases
Capacitance; Electromagnetic compatibility; Numerical methods; Printed circuit boards; Printed circuit design; Analytical equations; Engineering design; High-speed channels; PCB design; Printed circuit board designs; Typical structures; Via modeling; Via-barrel capacitances; Structural design; Physic-based via model; Separated-antipad via structure; Via-plane capacitance
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.