Title

EMI Radiation Physics using Generalized Characteristic Mode (GCM) Analysis with Loss for Practical Structures

Abstract

Characteristic mode analysis has been proposed for lossless case for decades. However, for real electromagnetic interference (EMI) structures, such as printed circuit board (PCB) midplane connector and heat sink, lossy material (such as copper) and terminations (resistive loads) are unavoidable which tradidiotnal CM method cannot handle. In this paper, a generalized CM analysis for lossy material and/or with resistive loads is developed for practical structures. With the proposed method, by applying integral-equation (IE) based method and characteristic mode (CM) analysis, the current is split into radiating and non-radiating ones. The radiated power from each part of the structure can be quantified using the radiating current. Therefore, the radiation hot spot can be identified. This method facilitates the CM method in real applications.

Meeting Name

26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS (2017: Oct. 15-18, San Jose, CA)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Sponsor(s)

National Science Foundation (U.S.)

Comments

This material is based upon work supported by the National Science Foundation under Grant No. IIP-1440110.

Keywords and Phrases

Electromagnetic pulse; Electromagnetic wave interference; Electronics packaging; Integral equations; Signal interference; Characteristic modes; CM method; Lossy materials; Printed circuit boards (PCB); Radiated power; Radiation physics; Real applications; Resistive loads; Printed circuit boards; Electromagnetic interference (EMI); Generalized characteristic mode (GCM); Lossy case

International Standard Book Number (ISBN)

978-1-5386-3632-9

International Standard Serial Number (ISSN)

2165-4115

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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