Differential Integrated Crosstalk Noise (ICN) Reduction among Multiple Differential BGA and Via Pairs by using Design of Experiments (DoE) Method

Abstract

The integrated crosstalk noise (ICN) has been wildly used as an alternative to the insertion crosstalk ratio (ICR) for channel crosstalk evaluation in the IEEE 802.3ba standard. In this work, a differential ICN analysis is performed for several configurations of package-to-PCB transitions. Using the design of experiment (DoE) statistical method, differential ICN is quickly estimated for various input factors such as pin mapping, physical dimensions, and level of shielding. Optimization guide line is proposed to maintain the tradeoff among the differential ICN, design space, and manufacturing cost.

Meeting Name

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI (2017: Aug. 7-11, Washington, DC)

Department(s)

Electrical and Computer Engineering

Sponsor(s)

National Science Foundation (U.S.)

Comments

This material is based upon work supported partially by the National Science Foundation under Grant No. IIP-1440110.

Keywords and Phrases

Ball grid arrays; Crosstalk; Design of experiments; Electromagnetic compatibility; Electromagnetic shielding; Polychlorinated biphenyls; Channel crosstalk; Crosstalk noise; Crosstalk ratio; Design spaces; Fan Out; Input factors; Manufacturing cost; Physical dimensions; Analysis of variance (ANOVA); DoE; Dog bone fan-out; FFD; ICN; Via-in-pad fan-out

International Standard Book Number (ISBN)

978-1-5386-2229-2

International Standard Serial Number (ISSN)

1077-4076; 2158-1118

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2017

Link to Full Text

Share

 
COinS