Connectivity-Based Multichip Module Repair
This paper presents a new model for analyzing the yield of MCM systems with repair process. It exploits the connectivity of the interconnected chips in which yield degradation due to both neighboring chips and interconnect structure are taken into account. Based on the connectivity, two MCM repair scheduling strategies, Smallest Number of Interconnections First (SNIF) and Smallest Number of Neighboring Chips First (SNCF) are proposed. Two other scheduling strategies, Largest Number of Interconnections First (LNIF) and Largest Number of Neighboring Chips First (LNCF) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall yield of MCMs. Extensive parametric simulations demonstrate the efficiency of the proposed MCM repair scheduling strategies.
M. Choi et al., "Connectivity-Based Multichip Module Repair," Proceedings of the Pacific Rim International Symposium on Dependable Computing (2001, Seoul, South Korea), pp. 19-26, IEEE Computer Society, Dec 2001.
The definitive version is available at http://dx.doi.org/10.1109/PRDC.2001.992675
Pacific Rim International Symposium on Dependable Computing (2001: Dec. 17-19, Seoul, South Korea)
Electrical and Computer Engineering
Keywords and Phrases
Multichip Modules; Repair; Scheduling; Interconnect Structures; Parametric Simulations; Repair Process; Scheduling Strategies; Yield Degradation; Integrated Circuit Interconnects; Integrated Circuit Interconnections; Degradation; Testing; Assembly; Scheduling; Packaging; Delay Systems; System Performance; Fabrication; Maintenance Engineering; Printed Circuit Manufacture
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Article - Conference proceedings
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