Connectivity-Based Multichip Module Repair

Abstract

This paper presents a new model for analyzing the yield of MCM systems with repair process. It exploits the connectivity of the interconnected chips in which yield degradation due to both neighboring chips and interconnect structure are taken into account. Based on the connectivity, two MCM repair scheduling strategies, Smallest Number of Interconnections First (SNIF) and Smallest Number of Neighboring Chips First (SNCF) are proposed. Two other scheduling strategies, Largest Number of Interconnections First (LNIF) and Largest Number of Neighboring Chips First (LNCF) are also introduced and analyzed to further explore the impact of connectivity-based repair scheduling on the overall yield of MCMs. Extensive parametric simulations demonstrate the efficiency of the proposed MCM repair scheduling strategies.

Meeting Name

Pacific Rim International Symposium on Dependable Computing (2001: Dec. 17-19, Seoul, South Korea)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Multichip Modules; Repair; Scheduling; Interconnect Structures; Parametric Simulations; Repair Process; Scheduling Strategies; Yield Degradation; Integrated Circuit Interconnects; Integrated Circuit Interconnections; Degradation; Testing; Assembly; Scheduling; Packaging; Delay Systems; System Performance; Fabrication; Maintenance Engineering; Printed Circuit Manufacture

International Standard Book Number (ISBN)

769514146

International Standard Serial Number (ISSN)

1541-0110

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2001 IEEE Computer Society, All rights reserved.

Publication Date

01 Dec 2001

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