Title

Methodology of Physics-Based Model Development for Differential Vias

Abstract

Signal transition through vias is among the components of most concern in high-speed signal link-path analyses. Full-wave is widely used to predict the electric performance of vias. However, for better understanding the characteristic of via transition, physics-based via model is desired. This paper will discuss the development of physics-based via model from the perspective of methodology and behind physics. A simple differential via is used as an example to introduce the development of physics-based via model where the via structure is mapped to circuit components by tracking current-path. A via with ten-layer stack-up is then analyzed using peeling and partitioning method by cutting the via model into via blocks at its reference planes. The observation of electric field distribution along the interface circle of via anti-pad wall and the cutting plane demonstrates that the peeling and partitioning method is physics-based. The determination of TEM/quasi-TEM reference break-points on signal traces is essential for port assignment. Where and how to find the break-point is depicted in the paper as well. Finally, a simple case is studied to verify the methodology.

Meeting Name

40th International Symposium on Microelectronics (2007: Nov. 11-15, San Jose, CA)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Circuit Components; Current Paths; Electric Field Distributions; Field Distribution; High-Speed Signals; Partitioning Methods; Physics-Based Models; Physics-Based Via Models; Electric Fields; Microelectronics; Regression Analysis; Electronic Circuit Tracking; Current Path Tracking; Field Distribution Observation; Physics-Based Via Model; Structure Mapping; TEM Reference Determination

International Standard Book Number (ISBN)

0930815823; 9780930815820

International Standard Serial Number (ISSN)

2380-4505

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2007 International Microelectronics Assembly and Packaging Society, All rights reserved.

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