Frequency-Dependent Via Inductances for Accurate Power Distribution Network Modeling
In power distribution network (PDN) modeling, interconnection inductance can play a critical role. It often determines the effectiveness of a component, such as a decoupling capacitor. This paper studies a typical one-plane-pair PDN structure with parallel power and ground planes and vertical vias in between. This work improves the conventional lumped circuit model for the PDN by introducing a model for the inductance of each via that is frequency-dependent. This frequency dependency is obtained from a rigorous cavity model formulation. The improved lumped circuit model is validated with the cavity model and the HFSS full-wave model. Further, the frequency-dependent mutual inductance between two vias can have either a positive or a negative value depending on via locations in the PDN structure, which is an interesting property that has not been reported.
L. Ren et al., "Frequency-Dependent Via Inductances for Accurate Power Distribution Network Modeling," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2009, Austin, TX), pp. 63-68, Institute of Electrical and Electronics Engineers (IEEE), Aug 2009.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2009.5284628
IEEE International Symposium on Electromagnetic Compatibility (2009: Aug. 17-21, Austin, TX)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Cavity Model; Decoupling Capacitor; Frequency Dependencies; Frequency-Dependent; Full-Wave Model; Ground Planes; In-Between; Lumped Circuit Models; Mutual Inductance; Negative Values; Parallel Power; Power Distribution Network; Distributed Parameter Networks; Electromagnetic Compatibility; Inductance; Lumped Parameter Networks; Plastic Molds; Electric Network Analysis
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Article - Conference proceedings
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