Title

Extraction of Equivalent Inductance in Package-PCB Hierarchical Power Distribution Network

Abstract

A method to calculate equivalent inductances of multiple vias in arrays has been proposed. The method has been applied to the modeling of a hierarchical power bus and validated by measurements. It is accurate at the frequencies lower than the cavity resonant frequencies.

Meeting Name

18th Conference on Electrical Performance of Electronic Packaging and Systems (2009: Oct. 19-21, Portland, OR)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Resonant Frequencies; Equivalent Inductance; Multiple Vias; Power Bus; Power Distribution Network; Distributed Parameter Networks; Inductance; Natural Frequencies; Polychlorinated Biphenyls; Electronics Packaging

International Standard Book Number (ISBN)

9781424444472

International Standard Serial Number (ISSN)

2165-4107; 2165-4115

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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