Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs with Via Arrays

Author

Jingook Kim
Ketan Shringarpure
Jun Fan, Missouri University of Science and TechnologyFollow
Joungho Kim
James L. Drewniak, Missouri University of Science and TechnologyFollow

Abstract

An equivalent circuit model for multilayer power planes with multiple via arrays is proposed. The complexity of the actual geometry is greatly reduced in the circuit model with the accuracy maintained. The model is corroborated by measurements.

Recommended Citation

J. Kim et al., "Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs with Via Arrays," IEEE Microwave and Wireless Components Letters, vol. 21, no. 2, pp. 62 - 64, Institute of Electrical and Electronics Engineers (IEEE), Feb 2011.

The definitive version is available at https://doi.org/10.1109/LMWC.2010.2100079

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Model; Circuit Models; Decoupling Capacitor; Parallel Planes; Power Distribution Network (PDN); Electric Network Analysis; Inductance; Capacitors; Circuit Model

International Standard Serial Number (ISSN)

1531-1309; 1558-1764

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2011 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Feb 2011