A Concise Multiple Scattering Method for Via Array Analysis in a Circular Plate Pair

Abstract

Parallel plate modes are excited by the magnetic frill currents in the via holes (anti-pads). These modes are expressed as cylindrical waves. Multiple scattering of these modes among vias as well as from the edge boundaries of the plate pair are rigorously considered with the addition theorem of the cylindrical waves. An admittance matrix is derived for the via ports at the top/bottom surfaces of the via holes. Good agreement has been found between numerical simulations and the algorithm presented.

Meeting Name

IEEE Electrical Design of Advanced Packaging and Systems Symposium (2008: Dec. 10-12, Seoul, South Korea)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Addition Theorems; Admittance Matrices; Array Analysis; Circular Plates; Cylindrical Waves; Multiple Scattering Methods; Numerical Simulations; Parallel Plates; Via Holes; Multiple Scattering; Packaging

International Standard Book Number (ISBN)

978-1424426331

International Standard Serial Number (ISSN)

2151-1225; 2151-1233

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Dec 2008

Link to Full Text

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