The Evaluation Method for ESD Immunity of Components in Terms of Soft Error
A hand-held product like a camera and a mobile-phone must be satisfied with ESD Standard. Mostly IEC 61000-4-2 is applied. In this SET-level ESD test, considerable reason of failure is malfunction of major semiconductor parts (CPU, Memory and Sensor etc.) Recently, due to the semiconductor becoming more refined, high speed and multifunction, that failure trend is getting more general. The importance of cooperation between set developer and component developer has been emphasized in ESD field. Especially, making a correlation in measurement and analytical method is very important. Through this paper, the evaluation method for ESD immunity of components will be suggested for designing ESD robust product.
J. Lim et al., "The Evaluation Method for ESD Immunity of Components in Terms of Soft Error," Proceedings of EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility (2011, York, UK), pp. 468-471, Institute of Electrical and Electronics Engineers (IEEE), Sep 2011.
EMC Europe 2011 York - 10th International Symposium on Electromagnetic Compatibility (2011: Sep. 26-30, York, UK)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Analytical Method; Component-level; ESD; ESD Test; Evaluation Method; Soft-error; Electromagnetic Compatibility; Electromagnetism; Electrostatic Discharge; Electrostatic Devices; Component-level
International Standard Book Number (ISBN)
Article - Conference proceedings
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