A Study on Correlation between Near-Field EMI Scan and ESD Susceptibility of ICs

Abstract

Correlation between near-field EMI scan and ESD susceptibility scan of a cellphone CPU IC is investigated. It is shown that the ESD susceptibility of the CPU IC depends on the activity of the IC. Based on the obtained correlation between these two scans, it is sufficient to perform the ESD susceptibility scan only by running the application which highly loads the CPU. This reduces the ESD susceptibility measurement time as well as the probability of physical damage to the IC.

Meeting Name

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (2017: Aug. 7-11, Washington, DC)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Electromagnetic Compatibility; Electrostatic Devices; Electrostatic Discharge; Timing Circuits; Cell Phone; Near Fields; Physical Damages; Soft Failure; Susceptibility Measurements; Integrated Circuits; EMI; ESD; TLP

International Standard Book Number (ISBN)

978-1-5386-2231-5; 978-1-5386-2229-2

International Standard Serial Number (ISSN)

2158-1118

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2017

Link to Full Text

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