A Compact and Wideband Electromagnetic Bandgap Structure using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Abstract

In this paper, we propose a compact and wideband electromagnetic bandgap (EBG) structure using a defected ground structure (DGS) to significantly enhance the wideband suppression of power/ground noise coupling in multilayer packages and printed circuit boards. The proposed EBG structure is implemented simply by adding a rectangular-shaped DGS which is etched periodically onto the ground plane without changing any other geometrical parameter from a mushroom-type EBG structure. The DGS effects on the fL and fU are thoroughly analyzed using the dispersion characteristics. We experimentally verified that the proposed EBG structure achieved the wideband power/ground noise suppression (below 40 dB) between 2.5 and 16.2 GHz. In addition, we demonstrated the considerable reduction in fL from 3.4 to 2.5GHz and a significant increase in fU from 9.1 to 16.2 GHz when compared with the mushroom-type EBG structure.

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Defected Ground Structure; Electromagnetic Bandgap; Package; Power/ground Noise; Printed Circuit Board

International Standard Serial Number (ISSN)

0018-9375

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jun 2012

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