High-Speed Serial Link Challenges using Multi-Level Signaling
The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.
N. Dikhaminjia et al., "High-Speed Serial Link Challenges using Multi-Level Signaling," Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA), pp. 57-60, Institute of Electrical and Electronics Engineers (IEEE), Dec 2015.
The definitive version is available at http://dx.doi.org/10.1109/EPEPS.2015.7347129
24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015: Oct. 25-28, San Jose, CA)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Jitter; equalization; High speed serial links; Lossy materials; Multi-level signaling; PAM4; Various Channels; Electronics packaging; NRZ
International Standard Book Number (ISBN)
Article - Conference proceedings
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