Title

High-Speed Serial Link Challenges using Multi-Level Signaling

Abstract

The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.

Meeting Name

24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015: Oct. 25-28, San Jose, CA)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Jitter; equalization; High speed serial links; Lossy materials; Multi-level signaling; PAM4; Various Channels; Electronics packaging; NRZ

International Standard Book Number (ISBN)

9781479936410

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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