An EMI Estimation for Shielding Edge Treaments on a Printed Circuit Board
Various PCB edge treatments including via stitching and edge plating connecting ground planes can be employed to suppress the EMI from multilayer printed circuit boards. The shielding performance of these edge treatments is studied in this work. Design curves and an empirical equation are given based on parametric study to summarize the variation of the total radiated power (TRP) as a function of slot length (spacing between vias) and number of openings. Comparisons between measurements and simulation suitably agree within engineering accuracy.
S. Bai et al., "An EMI Estimation for Shielding Edge Treaments on a Printed Circuit Board," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada), pp. 633-638, Institute of Electrical and Electronics Engineers (IEEE), Jul 2016.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2016.7571722
IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
National Science Foundation (U.S.)
Keywords and Phrases
Electromagnetic Compatibility; Electromagnetic Shielding; Reconfigurable Hardware; Shielding; Empirical Equations; Multilayer Printed Circuit Board; Parametric Study; Shielding Effectiveness; Shielding Performance; Total Radiated Power; Printed Circuit Boards; Apertures; Edge Platting; EMI; TRP
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Article - Conference proceedings
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