Title

Analytical Equivalent Circuit Modeling for Multiple Core Vias in a High-Speed Package

Abstract

Core vias found in the packages of high-speed ICs can have a large impact on overall channel performance. Thus accurately modeling core vias in the package is essential. In this paper analytical methodologies are used to calculate equivalent circuit models of core vias.

Meeting Name

2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Keywords and Phrases

Equivalent Circuit; Modeling; Core Via; Package; Analytical

International Standard Serial Number (ISSN)

2158-1118

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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