Transient Simulation for Power Integrity Using Physics Based Circuit Modeling
Abstract
A transient simulation analysis is proposed for printed circuit board (PCB) power distribution network (PDN) by using physics based circuit model. The PCB PDN is divided into different blocks. Different modeling methods are used to provide physics-based circuit models for each block. Then, Hspice simulation is used to do transient simulation for the PCB PDN based on the circuit.
Recommended Citation
B. Zhao and C. Huang and K. Shringarpure and S. Bai and T. Makharashvili and Y. S. Cao and B. Achkir and M. A. Cracraft and M. Cocchini and S. R. Connor and B. Archambeault and L. Jiang and A. E. Ruehli and J. Fan and J. L. Drewniak, "Transient Simulation for Power Integrity Using Physics Based Circuit Modeling," Proceedings of the 7th Asia-Pacific International Symposium on Electromagnetic Compatibility (2016, Shenzhen, China), pp. 1087 - 1089, Institute of Electrical and Electronics Engineers (IEEE), May 2016.
The definitive version is available at https://doi.org/10.1109/APEMC.2016.7522952
Meeting Name
7th Asia-Pacific International Symposium on Electromagnetic Compatibility (2016: May 17-21, Shenzhen, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Circuit simulation; Circuit theory; Electric network analysis; Electromagnetic compatibility; Printed circuit boards; Printed circuits; Reconfigurable hardware; Cavity model; Hspice simulations; Parallel planes; Physics-based circuit models; Power distribution network; Power integrity; Printed circuit boards (PCB); Transient simulation; SPICE
International Standard Book Number (ISBN)
978-146739494-9
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2016
