PAM4 Signaling Considerations for High-Speed Serial Links
The paper discusses current challenges and advantages of multi-level signaling for high-speed serial links, showing the differences and similarities in link-path analysis between binary and multi-level signaling. Comparison of two signaling methodologies is given from the general theory viewpoint, as well as on the basis of various tests regarding crosstalk, jitter, equalizations and different channel characteristics, such as material, impedance and overall manufacturing design sensitivity.
N. Dikhaminjia et al., "PAM4 Signaling Considerations for High-Speed Serial Links," Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada), pp. 906-910, Institute of Electrical and Electronics Engineers (IEEE), Jul 2016.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2016.7571771
2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Electrical and Computer Engineering
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic compatibility; Pulse amplitude modulation; Regression analysis; Channel characteristics; equalization; General theory; High speed serial links; Manufacturing design; Multi-level signaling; PAM4; Path analysis; Signaling; NRZ
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
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