Numerical Investigation of Glass-Weave Effects on High-Speed Interconnects in Printed Circuit Board
Numerical method is used to investigate the glass weave effects on via coupling and trace transmission properties. Studies indicate that a simple two-dimensional periodic structure is accurate enough for via coupling simulations while more complicated three-dimensional glass-weave structures have to be used for studies of trace transmission properties. Analytical formulas are provided to estimate the first resonant frequency of the glass weaves. The impact of trace-glass-weave orientations on resonances of traces has been investigated for both single-ended and differential striplines. It has been demonstrated that statistical Gaussian distribution of pitch sizes due to fabrication tolerance and the dielectric losses can reduce the glass-weave effects. The studies here are useful for better understanding of the high-frequency signal integrity performance of printed circuit boards.
X. Tian et al., "Numerical Investigation of Glass-Weave Effects on High-Speed Interconnects in Printed Circuit Board," IEEE International Symposium on Electromagnetic Compatibility, pp. 475-479, Institute of Electrical and Electronics Engineers (IEEE), Aug 2014.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2014.6899019
2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 4-8, Raleigh, NC)
Electrical and Computer Engineering
Center for High Performance Computing Research
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Dielectric losses; Electromagnetic compatibility; Glass; Natural frequencies; Numerical methods; Printed circuits; Resonance; Scattering parameters; Strip telecommunication lines; Weaving; Analytical formulas; Coupling simulation; Fabrication tolerances; High frequency signals; High-speed interconnects; Numerical investigations; Transmission property; Two-dimensional periodic structures; Printed circuit boards; Glass-weave
International Standard Serial Number (ISSN)
Article - Conference proceedings
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