Title

Modeling of Multiple Vias with a Shared Anti-Pad in an Irregular Plate Pair Using Domain Decomposition Approach

Abstract

An irregular plate pair with multiple vias sharing an anti-pad is decomposed into top/bottom plate-thickness domain and parallel-plate domain whose admittance matrices are calculated by three-dimensional (3D) finite element method (FEM) and hybrid 3D/2D FEM. Combined admittance matrix algorithm is used to obtain the final admittance matrix of the plate pair including finite thickness plates. The widely-used assumption of transverse electromagnetic (TEM) modes on anti-pads is carefully investigated by comparing the combined admittance matrix algorithm with hybrid 3D/2D FEM. It is found that higher-order modes are excited on anti-pads and in practical printed circuit board, the higher-order modes can penetrate from one layer of plate pair to another layer. This may provide guidance for future research for multiple vias in a shared anti-pad.

Meeting Name

2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 4-8, Raleigh, NC)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Keywords and Phrases

Domain decomposition methods; Electromagnetic compatibility; Printed circuit boards; Printed circuits; Admittance matrices; Domain decompositions; Finite thickness plates; Higher-order modes; Parallel plates; Provide guidances; Three dimensional (3 D) finite element methods (FEM); Transverse electromagnetic mode; Finite element method

International Standard Serial Number (ISSN)

10774076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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