De-Embedding Techniques for Transmission Lines: An Application to Measurements of On-Chip Coplanar Traces
In this paper, the de-embedding study presented in  is extended from the simulation environment to the measurement environment; the three presented de-embedding methods are applied to measurements of on-chip coplanar traces for two different test ICs. Additionally, the Hybrid technique presented in  is reformulated so that only two measurement standards are required, as opposed to three. The results of de-embedding the measurement data are discussed, as well as challenges with making the measurements.
N. Erickson et al., "De-Embedding Techniques for Transmission Lines: An Application to Measurements of On-Chip Coplanar Traces," IEEE International Symposium on Electromagnetic Compatibility, pp. 660-666, Institute of Electrical and Electronics Engineers (IEEE), Aug 2014.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2014.6899052
2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 4-8, Raleigh, NC)
Electrical and Computer Engineering
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
De-embedding; De-embedding method; De-embedding techniques; Hybrid techniques; Measurement data; Measurement standards; Measurements of; Simulation environment; Electromagnetic compatibility
International Standard Serial Number (ISSN)
Article - Conference proceedings
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