Accurate Characterization of PCB Transmission Lines for High Speed Interconnect
Abstract
Accurate PCB transmission-line characterization can be challenging due to the effect of test fixtures and launching vias, etc. In this paper, VNA measurements with innovative de-embedding approaches, including those that utilize only one '2X-Thru' calibration standard are studied. The 2X-Thru de-embedding method is first shown to be correlated to existing TRL calibration method. Test boards built with varying lengths of transmission lines routed on different layers were then characterized with the new de-embedding method. Excellent de-embedded results are achieved for frequencies up to 30 GHz.
Recommended Citation
X. Ye et al., "Accurate Characterization of PCB Transmission Lines for High Speed Interconnect," Proceedings of the Asia-Pacific International Symposium on Electromagnetic Compatibility (2015, Taipei, Taiwan), pp. 16 - 19, Institute of Electrical and Electronics Engineers (IEEE), May 2015.
The definitive version is available at https://doi.org/10.1109/APEMC.2015.7175382
Meeting Name
Asia-Pacific International Symposium on Electromagnetic Compatibility (2015: May 25-29, Taipei, Taiwan)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Calibration; Electromagnetic compatibility; Calibration standard; De-embedding; De-embedding method; Different layers; High speed interconnect; Test fixture; TRL calibration; Electric lines
International Standard Book Number (ISBN)
978-1-4799-6670-7
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2015
