Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements
One of the most widely used methods for evaluating the electromagnetic compatibility of integrated circuits (ICs) involves mounting the IC on a printed circuit board embedded in the wall of a TEM cell. TEM cell measurements are influenced by both electric and magnetic field coupling from the IC and its package. This paper describes how a TEM cell and a hybrid can be used to isolate electric field coupling from magnetic field coupling. Knowledge of the dominant field coupling mechanism can be used to troubleshoot radiated emissions problems due to ICs.
V. Kasturi et al., "Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements," 2006 IEEE International Symposium on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers (IEEE), Jan 2006.
Electrical and Computer Engineering
Keywords and Phrases
Component; Field Coupling; Package
Article - Conference proceedings
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.