Title

Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements

Abstract

One of the most widely used methods for evaluating the electromagnetic compatibility of integrated circuits (ICs) involves mounting the IC on a printed circuit board embedded in the wall of a TEM cell. TEM cell measurements are influenced by both electric and magnetic field coupling from the IC and its package. This paper describes how a TEM cell and a hybrid can be used to isolate electric field coupling from magnetic field coupling. Knowledge of the dominant field coupling mechanism can be used to troubleshoot radiated emissions problems due to ICs.

Meeting Name

2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 (2006: Aug. 14-18, Portland, OR)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Component; Field Coupling; Package

International Standard Book Number (ISBN)

1-4244-0293-X

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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