Title

Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias

Abstract

This paper proposes a numerical solution of the nonlinear equations that describes the hysteretic behavior of the coupling capacitance among through silicon vias in three-dimensional integrated circuits. Behavioral ordinary differential equations are formulated and solved by an equivalent circuit described in SPICE syntax. These results are then compared with those obtained by measurements.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Keywords and Phrases

Circuit simulation; Differential equations; Electronics packaging; Hysteresis; Integrated circuit interconnects; Nonlinear equations; Ordinary differential equations; SPICE; Coupling capacitance; Dielectric hysteresis; Equivalent circuit model; Hysteretic behavior; Numerical solution; Through silicon vias; Three dimensional integrated circuits; equivalent circuit; nonlinear circuits; (TSVs); time domain

International Standard Serial Number (ISSN)

189375

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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