The effect on EMI of stitching multiple ground planes together along the periphery of multi-layer PCB stacks is studied. Power bus noise induced EMI and radiation from the board edges is the major concern herein. The EMI at 3 meters for different via stitch spacing and layer thickness is modeled with FDTD modeling. It is shown that the ground plane stitching effectively reduces the radiated EMI that results from fringing fields at the power bus edges. Two families of curves are generated to demonstrate the variation of the radiated EMI as a function of layer thickness and stitch spacing. Further studies show that the reduction of the EMI from ground plane stitching may be compromised by other radiation mechanisms.
X. Ye et al., "The EMI Benefits of Ground Plane Stitching in Multi-Layer Power Bus Stacks," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2000, Washington, D.C.), vol. 2, pp. 833-838, Institute of Electrical and Electronics Engineers (IEEE), Aug 2000.
The definitive version is available at https://doi.org/10.1109/ISEMC.2000.874730
IEEE International Symposium on Electromagnetic Compatibility (2000: Aug. 21-25, Washington, DC)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
EMI Benefits; FDTD Modeling; Board Edges; Earthing; Electromagnetic Interference; Finite Difference Time-Domain Analysis; Fringing Fields; Ground Plane Stitching; Layer Thickness; Multi-Layer PCB Stacks; Multi-Layer Power Bus Stacks; Noise; Power Bus Noise; Printed Circuit Boards; Printed Circuits; Radiated EMI Reduction; Stitch Spacing
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International Standard Serial Number (ISSN)
Article - Conference proceedings
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