A procedure of building SPICE models for signal via transitions between printed circuit board layers is presented in this paper. The method of extracting parameters of SPICE models from full-wave simulation tool is demonstrated. Then the validity of SPICE models is studied by comparing the solution from SPICE model with that from the full-wave simulation.
S. Luan and G. Selli and J. Fan and M. Lai and J. L. Knighten and N. W. Smith and R. Alexander and G. Antonini and A. Ciccomancini and A. Orlandi and J. L. Drewniak, "SPICE Model Libraries for Via Transitions," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2003, Boston, MA), vol. 2, pp. 859-864, Institute of Electrical and Electronics Engineers (IEEE), Aug 2003.
The definitive version is available at https://doi.org/10.1109/ISEMC.2003.1236721
IEEE International Symposium on Electromagnetic Compatibility (2003: Aug. 18-22, Boston, MA)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
CEMPIE; PEEC; SPICE; SPICE Model Library; Circuit Extraction Based On Mixed Potential Integral Equation; Full-Wave Simulation Tool; Integrated Circuit Interconnections; Multilayer PCB; Parameter Extraction; Partial Element Equivalent Circuit; Printed Circuit Board Layers; Printed Circuit Layout; Signal Via Transitions; PCB; Via Transition
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Article - Conference proceedings
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