Abstract

A procedure of building SPICE models for signal via transitions between printed circuit board layers is presented in this paper. The method of extracting parameters of SPICE models from full-wave simulation tool is demonstrated. Then the validity of SPICE models is studied by comparing the solution from SPICE model with that from the full-wave simulation.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility, 2003

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

CEMPIE; PEEC; SPICE; SPICE Model Library; Circuit Extraction Based on Mixed Potential Integral Equation; Full-Wave Simulation Tool; Integrated Circuit Interconnections; Multilayer PCB; Parameter Extraction; Partial Element Equivalent Circuit; Printed Circuit Board Layers; Printed Circuit Layout; Signal Via Transitions

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2003 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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