Abstract

VLSI semiconductor devices are often the source of radiated electromagnetic emissions from electronic devices. Noise coupled from these devices to resonant structures on the printed circuit board, resonant cables or resonant enclosures can result in EMI problems that are difficult or expensive to solve at the board or system level. This paper reviews three mechanisms by which noise can be coupled from semiconductor devices and packages resulting in radiated electromagnetic emissions.

Meeting Name

2004 International Symposium on Electromagnetic Compatibility, 2004

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

IC; VLSI; Integrated Circuit; Radiated EMI

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.


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