Abstract
VLSI semiconductor devices are often the source of radiated electromagnetic emissions from electronic devices. Noise coupled from these devices to resonant structures on the printed circuit board, resonant cables or resonant enclosures can result in EMI problems that are difficult or expensive to solve at the board or system level. This paper reviews three mechanisms by which noise can be coupled from semiconductor devices and packages resulting in radiated electromagnetic emissions.
Recommended Citation
T. H. Hubing et al., "Radiation Mechanisms for Semiconductor Devices and Packages," Proceedings of the 2004 International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA), pp. 489 - 492, Institute of Electrical and Electronics Engineers (IEEE), Aug 2004.
Meeting Name
2004 International Symposium on Electromagnetic Compatibility, EMC 2004 (2004: Aug 9-13, Santa Clara, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
IC; VLSI; Integrated Circuit; Radiated EMI
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2004
