Abstract

Power islands are often employed in printed circuit board (PCB) designs to alleviate the problem of power bus noise coupling between circuits. Good isolation can be obtained over a wide frequency band due to the large series impedance provided by the gap between the power islands. However, power bus resonances may degrade the isolation at high frequencies. The amount of isolation also depends on the type of connection between power islands and the components on the board. This paper experimentally investigates the effectiveness of several power island structures up to 3.0 GHz

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

3.0 GHz; PCB Design; SHF; Circuit Noise; Electric Impedance; Frequency Band; Island Structure; Power Bus Isolation; Power Bus Noise Coupling; Power Bus Resonances; Power Island Structures; Power Islands Connection; Printed Circuit Boards; Printed Circuit Design; Printed Circuit Testing; Resonance; Series Impedance

International Standard Serial Number (ISSN)

0018-9375

Document Type

Article - Journal

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Full Text Link

Share

 
COinS