Abstract
Power islands are often employed in printed circuit board (PCB) designs to alleviate the problem of power bus noise coupling between circuits. Good isolation can be obtained over a wide frequency band due to the large series impedance provided by the gap between the power islands. However, power bus resonances may degrade the isolation at high frequencies. The amount of isolation also depends on the type of connection between power islands and the components on the board. This paper experimentally investigates the effectiveness of several power island structures up to 3.0 GHz
Recommended Citation
J. Chen et al., "Power Bus Isolation Using Power Islands in Printed Circuit Boards," IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers (IEEE), Jan 2002.
The definitive version is available at https://doi.org/10.1109/TEMC.2002.1003403
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
3.0 GHz; PCB Design; SHF; Circuit Noise; Electric Impedance; Frequency Band; Island Structure; Power Bus Isolation; Power Bus Noise Coupling; Power Bus Resonances; Power Island Structures; Power Islands Connection; Printed Circuit Boards; Printed Circuit Design; Printed Circuit Testing; Resonance; Series Impedance
International Standard Serial Number (ISSN)
0018-9375
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 2002
