Numerical and experimental results of a microwave noncontact, nondestructive detection and evaluation of disbonds and thickness variations in stratified composite media are presented. The aperture admittance characteristics of a flange mounted rectangular waveguide radiating into a layered, generally lossy dielectric media backed or unbacked by a conducting sheet is modeled. The theoretical implementation is based on a Fourier transform boundary matching technique to construct the field components in each medium, coupled with a stationary form of the terminating aperture admittance of the waveguide. The model can serve as a reliable test bed for real-time examination of layered composite media. Experimental results for several cases are presented which show good agreement with the theoretical findings. This is a versatile technique for near-field in situ interrogation of stratified composite media which provides for high resolution measurements
N. Qaddoumi et al., "Microwave Noncontact Examination of Disbond and Thickness Variation in Stratified Composite Media," IEEE Transactions on Microwave Theory and Techniques, Institute of Electrical and Electronics Engineers (IEEE), Jan 1994.
The definitive version is available at http://dx.doi.org/10.1109/22.277431
2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting
Electrical and Computer Engineering
Keywords and Phrases
Fourier Transform Boundary Matching Technique; Fourier Transforms; Aperture Admittance Characteristics; Conducting Sheet Backing; Delamination; Disbond; Field Components; Flange Mounted Rectangular Waveguide; High Resolution Measurements; Layered Generally Lossy Dielectric Media; Microwave Measurement; Microwave Noncontact Examination; Nondestructive Detection; Nondestructive Testing; Real-Time Examination; Stratified Composite Media; Thickness Measurement; Thickness Variation; Composite Testing and Evaluation; Electromagnetic Formulation-Probe Development and Antennas
International Standard Serial Number (ISSN)
Article - Journal
© 1994 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.