Abstract

Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. Two experimental techniques, based on |S21| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FDTD) modeling, were used as experimental and numerical tools for inter-printed-circuit-board (inter-PCB) connector evaluation. The EMI performance of a lab-constructed stacked-card connector, and a commercially available module-on-backplane connector were studied. EMI characteristics of the connectors are demonstrated by investigating a few aspects of the design: type of shield/ground blade for signal return, number and length of ground pins, signal pin designation, etc. Good agreement is achieved between the measurements and the FDTD modeled results.

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

EMI Coupling; EMI Performance; FDTD Modeling; Common-Mode Current Measurement; Electric Connectors; Electric Current Measurement; Electric Field Measurement; Electromagnetic Coupling; Electromagnetic Interference; Electromagnetic Interference Coupling; Electromagnetic Shielding; Finite Difference Time Domain Modeling; Finite Difference Time-Domain Analysis; Ground Pin Length; High-Performance Inter-PCB Connectors; Inter-Board Connection; Magnetic Field Measurement; Module-On-Backplane Connector; Near-Field Measurement; Printed Circuit Testing; Shield/Ground Blade; Signal Pin Designation; Signal Return; Stacked-Card Connector; Common-Mode Current; Finite-Difference Time Domain (FDTD); Inter-Printed-Circuit-Board (Inter-PCB) Connector; Near Field; S Parameter

International Standard Serial Number (ISSN)

0018-9375; 1558-187X

Document Type

Article - Journal

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Feb 2002

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