Abstract

PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2000: Aug. 21-25, Washington, DC)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

EMI Problems; FDTD Modeling; FEM/MOM Modeling; PCB Edge; PCB Layout; PCB Traces; Design Maxims; Electromagnetic Interference; Experiment; Finite Difference Time-Domain Analysis; Finite Element Analysis; High Frequency Components; High-Speed Signals; Method of Moments; Numerical Modeling; Printed Circuit Design; Printed Circuit Layout; Trace Routing

International Standard Book Number (ISBN)

780356772

International Standard Serial Number (ISSN)

0190-1494

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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