Signal integrity (SI) analysis of printed circuit boards for high-speed digital design requires information on the perunit-length R, L, G, C parameters of the transmission lines. However, these are not always available when the property of the dielectric medium used in the board is unknown. A method to extract R, L, G, and C parameters from parallel-plate and strip transmission line geometries is proposed. It is based on measured scattering parameters and analytical modeling. A genetic algorithm (GA) is used to optimize the extraction by minimizing the frequency domain discrepancy between an objective function, which is the measured scattering matrix parameter, |S21|, and a GA model based on transmission line theory. The extracted R, L, G, and C parameters are then used in a SPICE model for simulation. Good agreement has been achieved in the reported results.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2004: Aug. 9-13, Santa Clara, CA)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

S-Matrix Theory; S-Parameters; SPICE; Dielectric Medium; Dispersive Planar Transmission Lines; Distributed Parameter Networks; Frequency Domain; Frequency-Domain Analysis; Genetic Algorithm; Genetic Algorithms; High-Speed Digital Design; Linear Network Analysis; Minimisation; Parallel-Plate Transmission Line; Printed Circuit Boards; Printed Circuit Design; Scattering Matrix Parameter; Scattering Parameters; Signal Integrity Analysis; Strip Lines; Strip Transmission Line; Transmission Line Parameter Extraction; Transmission Line Theory; R,L,G,C Extraction; Signal Integrity; Transmission Line

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.