The modeling and the analysis of the power distribution networks (PDN) within multi-layer printed circuit board is crucial for the investigation of the performance of PCB systems. Carrying out such analyses in SPICE based tools has the advantage of being faster than the corresponding full-wave modeling and it allows obtaining both frequency and time domain results.
G. Selli et al., "Complex Power Distribution Network Investigation Using SPICE Based Extraction from First Principle Formulations," Proceedings of the IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005., Institute of Electrical and Electronics Engineers (IEEE), Jan 2005.
The definitive version is available at http://dx.doi.org/10.1109/EPEP.2005.1563754
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
Electrical and Computer Engineering
Keywords and Phrases
PCB Systems; SPICE; SPICE Based Extraction; Frequency Domain Analysis; Full-Wave Modeling; Integrated Circuit Interconnections; Multilayer Printed Circuit Board; Power Distribution Network; Printed Circuits; Time Domain Analysis; Time-Domain Analysis
Article - Conference proceedings
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