A novel approach of equivalent circuit model extraction is developed for modeling of integrated package and PCB power distribution networks (PDN). The integrated PDNs are formulated from a full-wave finite-difference algorithm, and the resulting matrix equations are converted to equivalent circuits. The equivalent circuits, as well as the decoupling capacitors and the attached circuit components, can be analyzed with a SPICE-like solver in both the time and frequency domains. The modeling of dielectric loss is also addressed. The method is used to model three PDN problems including a simple power bus, a BGA package mounting on a PCB, and a 3-D power bus structure. The results are compared to either measurement data or other numerical results. The limitations of the method are also discussed.
S. Sun et al., "Characterizing Package/PCB PDN Interactions from a Full-Wave Finite-Difference Formulation," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2006, Portland, OR), vol. 2, pp. 550-555, Institute of Electrical and Electronics Engineers (IEEE), Aug 2006.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2006.1706366
IEEE International Symposium on Electromagnetic Compatibility (2006: Aug. 14-18, Portland, OR)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Packaging; Finite Difference Methods; Equivalent Circuits; Transmission Line Matrix Methods; Integral Equations; Time Domain Analysis; SPICE; Sparse Matrices; Electromagnetic Modeling; Dielectric Losses; Algorithms; Capacitors; Dielectric Losses; Finite Difference Time Domain Method; Decoupling Capacitors; Matrix Equations; Power Delivery Networks; Power Distribution Networks (PDN); Printed Circuit Boards; Equivalent Circuit; FDTD; Power Delivery Network
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Article - Conference proceedings
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